In high temperature environments, the performance of telecom relays will be affected in many ways. First, the insulation performance will be significantly reduced. Insulating materials are prone to softening or even melting under the continuous action of high temperature, which directly leads to a decrease in insulation resistance. Once the insulation resistance is reduced, it may cause insulation failure, making the relay face safety hazards such as short circuits during operation. Secondly, the mechanical structure will also deform due to high temperature. Metal parts will expand and deform at high temperatures, which may cause changes in the contact gap. Changes in the contact gap will seriously affect the stability of the pull-in and release parameters, causing the relay to have problems such as loose pull-in or delayed release when operating, affecting its normal function.

Furthermore, the contact performance will accelerate deterioration. High temperature will accelerate the oxidation process on the contact surface, form film resistance, and reduce the reliability of contact, especially in low-level conditions, this effect is more obvious. At the same time, contact corrosion will also intensify. When switching power loads, the arc breaking ability will decrease, which is easy to cause contact adhesion or metal transfer failures. Finally, the coil resistance will increase. The coil resistance increases with the temperature, which means that a larger current is required for the relay to work properly, resulting in increased power consumption, further exacerbating the temperature rise and forming a vicious cycle.

Low temperature environment will also have many adverse effects on the performance of telecommunications relays. On the one hand, the problem of material embrittlement and fracture is prominent. Under low temperature conditions, metal parts will become brittle and hard, prone to fracture or mechanical damage, which directly threatens the structural integrity of the relay. In addition, the cold adhesion of the coating material will be aggravated, which may cause cold adhesion failure under low current load, affecting the normal operation of the relay. On the other hand, there is a problem with contact conduction. For non-sealed relays, frost may form between the contacts in a low temperature environment, resulting in poor conduction or increased contact resistance, affecting signal transmission. For soldered tin-sealed relays, low temperature will cause the tin material to crack, which may affect the airtightness and thus affect the performance of the relay. In addition, low temperature will also cause the coil resistance to decrease. After the coil resistance decreases, the current may increase abnormally, further causing problems such as coil overheating or even damage, seriously affecting the service life and reliability of the relay.

If the relay is in a high or low temperature environment for a long time, the internal parameters of the relay will undergo irreversible changes. Changes in these parameters will shorten the service life of the relay and make the relay more prone to failure during operation. At the same time, under extreme temperatures, the reliability of the relay's operation will be significantly reduced. The relay may not be able to attract and release according to the preset action requirements, causing problems such as misoperation or failure, affecting the stability of the entire system. In addition, temperature fluctuations may also cause the relay performance parameters to exceed the design tolerance. Each relay has a certain performance parameter range when it is designed. Temperature fluctuations will cause these parameters to deviate from the normal range, thereby affecting the normal operation of the relay, resulting in system performance degradation or even failure.

In order to cope with the impact of temperature on the performance of telecommunications relays, a series of optimization and response measures need to be taken in design and application. In terms of material selection, high-temperature and low-temperature resistant engineering plastics and metal materials should be used. These materials can better adapt to different temperature environments and improve the environmental adaptability of relays. At the same time, optimize the ratio of contact materials to ensure conductivity while improving corrosion resistance and reducing the performance degradation of contacts under temperature changes. In terms of heat dissipation and protection, design a reasonable heat dissipation structure to reduce temperature rise in high-temperature environments and prevent relays from being damaged due to overheating.

Adopt a sealed design to prevent condensation and icing in low-temperature environments and ensure the normal conduction of contacts. In addition, a temperature compensation circuit can be added to dynamically adjust the circuit so that the relay parameters can adapt to temperature changes and maintain performance stability. In the testing and verification phase, high temperature aging tests and low temperature storage tests are performed to simulate different temperature environments and verify the performance stability of the relay under extreme temperatures. Strict temperature adaptability standards are formulated to ensure that the relay can meet performance requirements within the specified temperature range, providing guarantee for the reliable operation of the system.